PiBond开发的金属氧化物硬掩模材料在MEMS制造的重要工艺步骤中表现优异。这些金属氧化物材料还可被用于制造三维集成电路的深硅通孔。跟传统材料相比，我们的材料除了能提供更高的经济效益，还能极大地改善工艺性能。
Microelectromechanical systems (MEMS) are the very small devices which serve as sensors in a myriad of appliances we use.
MEMS, also referred as micromachines, are miniaturized mechanical components which are formed on silicon and other substates by etch processes.
Our SAP hard mask products simplify the etch process and does this at a lower cost of ownership. The products enable and facilitate miniaturization of MEMS devices by enabling finer features with improved control of critical dimensions and etch selectivities.
SG products have been used for decades and find increasing use in new applications. SG products are predominately used as inter layer dielectrics in integrated circuits.
The materials are coated on substrates where these fill narrow gaps and the excess material is either totally (ILD) or partially (PMD) removed by an etch process.
Our products under development include photodefinable siloxane dielectrics. These can be patterned using standard lithographic techniques and find a number of uses, such as a redistribution and passivation in device packaging.
These will be launched as our products meet the strict, ambitious specifications we have set for them.